3m 583 Thermal Bonding Film for FPC and Plastic

Product Details
Customization: Available
Certification: RoHS, ISO9001
Color: Brown
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Number of Employees
62
Year of Establishment
2016-08-11
  • 3m 583 Thermal Bonding Film for FPC and Plastic
  • 3m 583 Thermal Bonding Film for FPC and Plastic
  • 3m 583 Thermal Bonding Film for FPC and Plastic
  • 3m 583 Thermal Bonding Film for FPC and Plastic
  • 3m 583 Thermal Bonding Film for FPC and Plastic
  • 3m 583 Thermal Bonding Film for FPC and Plastic
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  • Overview
  • Product Description
  • Feature
Overview

Basic Info.

Model NO.
3M 583
Heat Resistance
High Temperature
Waterproof
Waterproof
Application
Plastic, Metal, Leather, Glass, Ceramic
Adhesive
Hot Melt Adhesive
Base Material
No Backing
Type
Double Sided Tape
Die Cutting
Yes
OEM
Yes
Transport Package
Carton
Specification
0.05mm x 1219mm x 55m
Trademark
3M
Origin
China
HS Code
3919909090
Production Capacity
1000 Rolls Per Month

Packaging & Delivery

Package Size
130.00cm * 30.00cm * 30.00cm
Package Gross Weight
20.000kg

Product Description

Product Description

 

3M 583 Brown Hot Melt Adhesive Film Thermal Bonding Film for FPC and Plastic Board Bonding

3M Thermal Bonding Film 583 is a high strength, flexible, nitrile phenolic based thermosetting adhesive film. It can be heat or solvent activated for bonding. It can also be lightly crosslinked using a post heat exposure.This hot melt film adhesive provides a strong, permanent bond to the surface to which it is applied. The adhesive can be used for splicing of glass fabric during PCB board manufacturing. Can be solvent activated in the uncured form.
3M TBF 583 must be stored at or below 4°C (40°F) for maximum storage life. 

 
Feature

* Flexible
* Heat or solvent activation
* Can be die-cut
* Slight surface tack
* Heat crosslinkable option
* Lower temperature lamination of the nitrile phenolic film range

3m 583 Thermal Bonding Film for FPC and Plastic

Base Resin
Nitrile phenolic
Adhesive Thickness
2 mil (0.05 mm)
Tack
Slight
Color
Brown
Construction
2 mil adhesive + 3 mil sillicone paper liner
Tensile (psi)
400 (before)  
3140 (after)
Elongation (%)
800 (before) 
180 (after)
Modulus (psi)
240 (before) 
13800 (after)
2 Lb. Dead Load Overlap Shear Heat Resistance
71°C (160°F) (before)
>149°C (300°F) (after)
To make a bond, remove the liner and place the adhesive film between the two substrates. The bond is then made through heat and pressure using a heated press, a hot roll laminator, a hot shoe thermode method or similar equipment. Alternatively, the adhesive can be first tacked (lightly bonded) to one of the substrates using low heat, the liner can then be removed and second substrate placed to the exposed adhesive surface, and a bond made using heat and pressure. Since 3M TBF 583 has a slight surface tack, in some cases it may be tacked to a substrate with pressure only (no heat).

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